Our customers benefit from a comprehensive suite of vertical integration solutions. Leveraging our Tekdata Interconnections business unit, we specialise in designing and manufacturing high-precision cable harnesses and interconnection assemblies that deliver accurate, reliable performance in the most demanding environments.

Trusted by researchers and innovators around the world, our custom cables, harnesses, and electromechanical sub-assemblies power cutting-edge developments in cryogenics, advanced scientific instrumentation, and the semiconductor industry.

Every assembly we build is engineered to meet exacting technical standards, ensuring dependable performance where precision truly matters.

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Applications

Our bespoke cable harness and interconnection solutions are proven across a wide range of high-performance research and industrial applications, including:

• DNA & RNA Sequencing
• Particle Accelerators
• Electron Microscopy
• Vapor Deposition Systems
• Quantum Computing

Each solution is purpose-built to perform in environments where temperature extremes, vacuum conditions, and electromagnetic interference demand exceptional reliability and control.

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Our Technologies

Cryogenic Cables

Our cryogenic cable assemblies are designed for precision, reliability, and performance at ultra-low temperatures. From coaxial lines for high-frequency signal transmission to miniature shielded cables for compact scientific systems, each design ensures clean, consistent data transfer even under the most extreme cryogenic conditions.

Key Features:

• Versatile configurations: single conductors or twisted pairs
• High-quality materials: brass, copper, or superconducting wire options
• Low-noise performance: optimised shielding for sensitive measurements

Whether used in quantum computing systems or particle detection instruments, our cryogenic cables deliver accuracy you can trust.

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Thermal Management Solutions

In cryogenic systems, effective heat management is essential for maintaining stability and accuracy. Our thermal solutions are engineered to minimise heat generation and ensure consistent system performance through advanced design techniques such as:

• Copper heatsinks: bonded to ribbon cable assemblies using thermal epoxy
• Epoxy backshells: for robust thermalisation
• Connector flanges or braid straps: tied to a heat stage ground plane

These configurations ensure superior thermal conductivity and mechanical integrity, keeping your system efficient and stable across extreme temperature ranges.

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Materials Expertise

Every application is unique, and so are its material requirements. We offer a comprehensive range of wire and conductor materials, allowing us to tailor each assembly for its specific operating environment and electrical performance needs.

Available materials include:

• Copper
• Manganin
• NbTi (Niobium-Titanium)
• CuNi (Copper-Nickel)
• Phosphor Bronze
• Stainless Steel
• Beryllium Copper
• ALI30

Each material is selected for its thermal properties, mechanical strength, and electrical performance, ensuring optimal results for your application.

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Precision Engineering That Powers Innovation

From laboratory research to industrial-scale production, Telford Scientific delivers complete electro-mechanical sub-assemblies with bespoke cable harnesses and interconnection systems that meet the most rigorous technical demands.

Our commitment to innovation, precision, and reliability ensures that every assembly we produce contributes to advancing scientific discovery and technological progress — redefining what’s possible in cryogenics, semiconductors, and beyond.

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