Driven by global demand for smaller, faster, and more energy-efficient electronics, semiconductor technology continues to evolve at a rapid pace - pushing the boundaries of both chip design and manufacturing equipment.

With decades of experience in high-precision components and critical subsystems, Telford Scientific partners with leading semiconductor OEMs to deliver integrated outsourced manufacturing solutions.
Our capabilities range from precision piece parts and complex sub-assemblies to full box-builds and high-level electro-mechanical assemblies.

Our dedicated engineering and manufacturing teams maintain ultra-high purity standards, ensuring every module and subsystem meets the stringent cleanliness and performance requirements of the industry.

These critical solutions enable our customers to accelerate time-to-market and mitigate supply chain risks.

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Core Capabilities:

• CNC Precision Machining & Turning
• Ultra-High Vacuum Cleaning
• TIG Welding
• CMM Inspection
• Polishing & Finishing
• Electromechanical Assembly

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