At our Tekdata Interconnections division, we design and manufacture cryogenic cable assemblies that perform reliably in extreme temperature and vacuum conditions - from 300 Kelvin (26°C) down to 4 millikelvin (-273°C), and across vacuum ranges extending to ultra-high vacuum (UHV).

Our products support a wide range of critical applications including ground-based observatories, cryogenic chambers, cryostat systems, and space exploration technologies. By combining precision engineering with innovative interconnection methods, we help researchers and engineers push the boundaries of what’s possible in science and technology.

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Expert Cryogenic Design and Consultation

Our dedicated cryogenic division provides advanced consultation and design support, offering expert guidance throughout every stage of development — from concept to production. We work closely with clients to ensure that every assembly meets stringent performance and industry standards for reliability, safety, and precision.

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Our Technologies

Shielding Solutions

Effective shielding is essential for maintaining signal integrity in extreme environments. Determining the correct shielding termination specification often requires careful distinction between 0V returns, chassis grounds, and Faraday shielding.

We offer 360° RFI/EMC shielding across both circular and rectangular connectors using encapsulated backshells. To optimise weight and simplify design, we can introduce a busbar system that consolidates individual grounds or return lines into dedicated pins or connector shells.

Available shielding materials include silver-plated copper, stainless steel, manganin, constantan, and phosphor bronze. We can configure assemblies with multiple shielding constructions such as:

• Individually Shielded Wires
• Single Wires
• Twisted Pairs
• Twisted Triples
• Twisted Quads

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Space-Saving and Weight Reduction

Our woven ribbon cable technology provides innovative space-saving solutions for systems where weight and flexibility are critical. These cables are lightweight, durable, and compact, capable of incorporating 100 wires as small as 0.1 mm in diameter into an assembly measuring just 25.4 mm by 0.6 mm.

This approach is ideal for high-density interconnections in cryogenic instruments, satellite systems, and scientific instrumentation.

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Vacuum Solutions

For ultra-high vacuum environments, we utilise polyether ether ketone (PEEK) due to its outstanding performance characteristics. PEEK is highly resistant to radiation, chemicals, and wear, and offers exceptionally low off-gassing, meeting strict vacuum compatibility standards.

Tekdata Interconnections conducts in-house vacuum leak testing using automated test equipment to ensure every assembly performs reliably under demanding conditions.

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Thermal Solutions

Thermal management is critical in cryogenic systems. We employ several heat control techniques, including:

• Copper heatsinks bonded with thermal epoxy to our ribbon cable assemblies
• Thermalisation via epoxy backshells
• Braid straps or flange-mounted heat stages for efficient heat dissipation

These solutions help minimise heat generation and maintain thermal equilibrium in sensitive cryogenic setups.

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Materials Expertise

We offer a comprehensive selection of wire materials tailored to specific performance needs, including:

• Copper
• Manganin
• NbTi (Niobium-Titanium)
• CuNi (Copper-Nickel)
• Phosphor Bronze
• Stainless Steel
• Beryllium Copper
• ALI30, and more

Each material is carefully chosen to ensure mechanical strength, thermal stability, and electrical performance in cryogenic and vacuum environments.

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Pushing the Limits of Low-Temperature Engineering

At Telford Scientific, our mission is to facilitate scientific research that changes the way we explore, work, and live. By delivering high-performance cryogenic cable assemblies engineered for precision and reliability, we empower researchers and engineers to advance innovation.

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